Low temperature cured epoxy adhesive
HX-8500/8600 is a single component low-temperature curing epoxy adhesive that can be applied to many materials, with excellent insulation properties and excellent adhesion. Especially suitable for components that are sensitive to heat and require low-temperature curing. Typical applications include Camera modules, Finger Print Sensors, Wearable Electronics, etc.
| project |
HX-8500 |
HX-8600 |
| appearance |
Black liquid |
Purple red liquid |
| Specific gravity g/cm ³ |
1.25 |
1.31 |
| Viscosity @ 25C, cps |
15000±3000 |
30000±6000 |
| curing temperature℃ |
100℃: 10 minutes |
100℃: 15 minutes 85℃: 30 minutes |
| Hardness, Shore D |
60 |
80 |
| Glass transition temperature (Tg) |
31℃ |
45℃ |
| Coefficient of thermal expansion (CTE) |
1=56 ppm/℃ 2=160ppm/℃ |
1=48 ppm/℃ 2=110 ppm/℃ |
| Storage modulus @27oC, MPa |
280 Mpa |
550 Mpa |
| Tensile strength, Mpa |
5 Mpa |
10 Mpa |
| lap shear strength |
15 MPa |
22 MPa |
| Water absorption rate |
<0.5 % |
<0.5 % |
| Volumetric resistance |
5.2x1014 Ohm/cm |
1.6x1014 Ohm/cm |
| Surface resistance |
1.9x1015 Ohm |
8.8x1014 Ohm |
List of Main Performance Parameters
| state |
project |
Parameter performance |
| Before curing |
Appearance of component A |
Yellow transparent liquid |
| Component A viscosity, 25 ℃, mPa. s |
500~1500 |
|
| Appearance of component B |
Countless transparent liquids |
|
| Component B viscosity, 25 ℃, mPa. s |
2000~3000 |
|
| Curing and shaping |
appearance |
Light yellow transparent |
| Hardness, Shore A |
70~80 |
|
| Tensile strength MPa |
>5 |
|
| elongation at break |
>500 |
|
| Water absorption rate% |
<2 |
|
| Volume resistance Ω |
1.0*1012 |
|
| Thermal conductivity coefficient W/(m * k) |
0.1~0.2 |
|
| Halogen ppm |
<1000 |
|
| VOC ppm |
<1000 |
Yue Gong Wang An Bei No. 4419002005671